Agilent Technologies 4294A Especificações

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Página 1 - Handbook

Agilent TechnologiesImpedance MeasurementHandbookJuly 2006

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1-4. True, effective, and indicated valuesA thorough understanding of true, effective, and indicated values of a component, as well as theirsignifican

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Figure 5-36. Measurement setup5-26

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5-11. Battery measurementThe internal resistance of a battery is generally measured using a 1 KHz AC signal. When a batteryis connected directly to t

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5-12. Test signal voltage enhancementWhen measuring the impedance of test signal level dependent devices, such as liquid crystals, induc-tors and high

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Figure 5-39. Connection diagram of test signal voltage enhancement circuit5-29

Página 7 - Impedance measurement basics

5-13. DC bias voltage enhancementDC biased impedance measurement is popularly used to evaluate the characteristics of the deviceunder the conditions w

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Figure 5-40. External DC bias measurement setupExternal DC voltage bias protection in 4TP configurationIf the measurement frequency is above 2 MHz or

Página 9 - 1-2. Measuring impedance

5-14. DC bias current enhancementDC current biasing is used for inductor and transformer measurement. In low frequency region, theE4980A or 4284A pre

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Take caution of electrical shock hazards when using the external DC bias circuit.A large energy is charged in L1 and L2 as well as the DUT (Lx) by a b

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5-15. Equivalent circuit analysis and its applicationAgilent’s impedance analyzers are equipped with an equivalent circuit analysis function. The pur

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Figure 5-44. Equivalent circuit modelsIf the simulated frequency response curve partially fits the measurement results, it can be said thatthe selecte

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1-5. Component dependency factorsThe measured impedance value of a component depends on several measurement conditions, suchas frequency, test signal

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Figure 5-45. Frequency response simulation for a low-value inductorFigure 5-46. Equivalent circuit enhancement5-3610 DIM Ztrc(1:201,1:2),Fmta$[9],Fmtb

Página 15 - SECTION 2

Measurement accuracy can be improved by taking advantage of the equivalent circuit analysis.Figure 5-47 (a) shows an Ls-Q measurement example for an i

Página 16 - Network analysis method

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Página 17 - Auto balancing bridge method

APPENDIX AThe concept of a test fixture’s additional error1. System configuration for impedance measurement Very often, the system configured for impe

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A-2The equation for the test fixture’s additional error is shown below:Ze = ± { A + (Zs/Zx + Yo•Zx) × 100} (%)De = Ze/100 (D ≤ 0.1)Ze : Additional er

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A-3Open offset error:The term, Yo•Zx × 100 is called open offset error. If the same analysis is carried out with admittance,then it can be concluded

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A-4Terminal connection method:In order to make short repeatability small, there are test fixtures which utilize the 4-terminal con-nection method (for

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A-5obtained. For open repeatability, measure the admittance of the test fixture’s open condition. In thesame way, determine open repeatability by meas

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B-1APPENDIX BOpen and short compensationThe open/short compensation used in Agilent’s instrument models the residuals as a linear networkrepresented b

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Figure 1-9. Capacitor frequency responseTest signal level:The test signal (AC) applied may affect the measurement result for some components. For exa

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B-2Figure B-1. Open/short compensation (2 of 2)

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C-1APPENDIX COpen, short and load compensationThe open/short/load compensation requires the measurement data of a standard DUT with knownvalues in add

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D-1APPENDIX DElectrical length compensationA test port extension can be modeled using a coaxial transmission line as shown in Figure D-1.When an imped

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D-2When a (virtual) transmission line in which the signal wavelength is equal to the wavelength in vac-uum is assumed, the virtual line length ( e) th

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E-1APPENDIX EQ Measurement accuracy calculationQ measurement accuracy for auto balancing bridge type instruments is not specified directly as ±%.Q

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www.agilent.com/find/emailupdatesGet the latest information on the products andapplications you select. Agilent Email Updateswww.agilent.comAgilent T

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Figure 1-11. DC bias dependencies of ceramic capacitors and cored-inductorsTemperature:Most types of components are temperature dependent. The temper

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SECTION 2Impedance measurement instruments2-1. Measurement methodsThere are many measurement methods to choose from when measuring impedance, each of

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2-2While the RF I-V measurement method is based on the sameprinciple as the I-V method, it is configured in a differentway by using an impedance match

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Figure 2-1. Impedance measurement method (3 of 3)2-3The current, flowing through the DUT, also flows through resistor R. Thepotential at the “L” poin

Página 37 - Fixturing and cabling

Table 2-1. Common impedance measurement methodsNote: Agilent Technologies currently offers no instruments for the bridge method and the resonant metho

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2-2. Operating theory of practical instrumentsThe operating theory and key functions of the auto balancing bridge instrument are discussed in theparag

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The measurement circuit is functionally divided into following three sections.The signal source section generates the test signal applied to the unkno

Página 41 - 3-3. Test fixtures

Figure 2-4. Auto balancing bridge section block diagramFigure 2-5. Vector ratio detector section block diagram2-7

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2-4. Key measurement functionsThe following discussion describes the key measurement functions for advanced impedance mea-surement instruments. Thoro

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2-4-2. DC biasIn addition to the AC test signal, a DC voltage can be output through the Hc terminal and applied tothe DUT. A simplified output circui

Página 44 - 3-4. Test cables

2-4-3. Ranging functionTo measure impedance from low values to high values, impedance measurement instruments haveseveral measurement ranges. General

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2-4-4. Level monitor functionMonitoring the test signal voltage or current applied to the DUT is important for maintaining accu-rate test conditions,

Página 46 - Figure 3-9. 4TP-4TP extension

Averaging function calculates the mean value of measured parameters from the desired number ofmeasurements. Averaging has the same effect on random n

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The induced errors are dependent upon test frequency, test fixture, test leads, DUT connection con-figuration, and surrounding conditions of the DUT.

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Figure 2-11. Guarding techniques2-4-8. Grounded device measurement capabilityGrounded devices such as the input/output of an amplifier can be measured

Página 49 - 3-7. RF test fixtures

Figure 2-12. Low-grounded device measurement2-15

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iThe Impedance Measurement HandbookA Guide to Measurement Technology and TechniquesCopyright®2000-2003 Agilent Technologies Co. LtdAll rights reserve

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2-5. Theory of RF I-V measurement methodThe RF I-V method featuring Agilent’s RF impedance analyzers and RF LCR meters is an advancedtechnique to meas

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Figure 2-13. Simplified block diagram for RF I-V method2-17

Página 53 - SECTION 4

2-6. Difference between RF I-V and network analysis measurement methodsWhen testing components in the RF region, the RF I-V measurement method is ofte

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Figure 2-14. Relationship of reflection coefficient to impedanceFigure 2-15. Measurement sensitivity of network analysis and RF I-V methods2-19

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Figure 2-16. Comparison of typical Q accuracy2-7. Key measurement functions2-7-1. OSC levelThe oscillator output signal is output through the coaxial

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2-7-3. CalibrationMost of the RF vector measurement instruments such as network analyzers need to be calibratedeach time a measurement is initiated or

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SECTION 3Fixturing and cablingWhen interconnecting a device under test (DUT) to the measurement terminals of the auto balancingbridge instrument, ther

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The four-terminal pair (4TP) configuration solves the mutual coupling problem because it uses coaxialcable to isolate the voltage sensing cables from

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Figure 3-2. Three-terminal (3T) configurationFigure 3-3. Four-terminal (4T) configuration3-3

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iiSECTION 3 Fixturing and cabling––––––– LF impedance measurement –––––––Paragraph 3-1 Terminal configuration ...

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Figure 3-4. Five-terminal (5T) configurationFigure 3-5. Four-terminal pair (4TP) configuration3-4

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3-2. Using test cables at high frequenciesThe 4TP configuration is the best solution for wide-range impedance measurement. However, inbasic 4TP measu

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Table 3-1. Test fixture’s DUT connection configuration and applications3-3-2. User fabricated test fixturesIf the DUT is not applicable to Agilent sup

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3-3-3. User test fixture exampleFigure 3-7 shows an example of a user fabricated test fixture. It is equipped with alligator clips asthe contact elec

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3-4. Test cablesWhen the DUT is tested apart from the instrument, it is necessary to extend the test ports(UNKNOWN terminals) using cables. If the ca

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Figure 3-8. Specifications of recommended cable (Agilent PN 8121-1218)3-4-3. Test cable extensionIf the required test cable is longer than 1 m, 2 m, o

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Figure 3-9. 4TP-4TP extensionFigure 3-10. Shielded 2T extension3-10

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Figure 3-11. Shielded 4T extensionTable 3-2. Summary of cable extension3-11Measurement frequency100 kHz and below 100 kHz and aboveLowTypically 4TP-4T

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3-5. Eliminating the stray capacitance effectsWhen the DUT has high impedance (e.g. Low Capacitance), the effects of stray capacitance are notnegligib

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Figure 3-13. Coaxial test port circuit configuration3-7. RF test fixturesRF test fixtures are designed so that the lead length (electrical path length

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iii4-7-1 Variance in residual parameter value ... 4-194-7-2 A difference in contact condition ...

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3-7-1. Agilent supplied RF test fixturesAgilent Technologies offers various types of RF test fixtures that meet the type of the DUT andrequired test f

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3-8. Test port extension in RF regionIn RF measurements, connect the DUT closely to the test port to minimize additional measurementerrors. When ther

Página 75 - SECTION 5

Figure 3-15. Calibration plane extensionFigure 3-16. Practical calibration and compensation at extended test port3-16

Página 76 - Table 5-1. Capacitor types

SECTION 4Measurement error and compensation4-1. Measurement errorFor real-world measurements, we have to assume that the measurement result always con

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4-2-1. Offset compensationWhen a measurement is affected by only a single component of the residuals, the effective value canbe obtained by simply sub

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Figure 4-3. Open/short compensation4-2-3. Precautions for open and short measurementsWhen an open measurement is made, it is important to accurately m

Página 79 - 5-2. Inductor measurement

Figure 4-4. Example of shorting device. (Agilent PN: 5000-4226)4-2-4. Open, short and load compensationsThere are numerous measurement conditions wher

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Figure 4-5. Open/short/load compensation4-2-5. What should be used as the load?The key point in open/short/load compensation is to select a load whose

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Figure 4-6. Electrode distance in load measurementFigure 4-7. Load value must be close to DUT’s value4-6

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Figure 4-8. Actual open/short load measurement example4-2-6. Application limit for open, short and load compensationsWhen the residuals are too signif

Página 83 - 5-3. Transformer measurement

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Figure 4-9. Effect of contact resistance4-8If RH = RL = Rhp = Rlc and Chp = Clp, D errorsof 2-terminal and 4-terminal become the samewhen Cx = ChpThis

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4-4. Measurement cable extension induced errorExtending a 4TP measurement cable from the instrument will cause a magnitude error and phaseshift of the

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Figure 4-11. Measurement error due to extended cable lengthThe cable length compensation works for test cables whose length and propagation constants

Página 87 - 5-4. Diode measurement

k value is a decimal number mostly within the range of -1 to +1 and different for different instru-ments. As the above equation shows, the error rapi

Página 88 - 5-5. MOS FET measurement

Figure 4-12. Compensation examples4-12

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4-6. Calibration and compensation in RF region4-6-1. CalibrationWhether the RF I-V method or network analysis, the open, short and load calibration mi

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When the test port is extended, calibration should be performed at the end of extension cable, asdiscussed in section 3. Thereby, the calibration pla

Página 91 - 42941A Impedance Probe

4-6-3. Compensation methodAs the error source model is different for the coaxial and non-coaxial sections of the test fixture,compensation method is a

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Accordingly, the residual parameters have greater effects on higher frequency measurements andbecome a primary factor of measurement errors. The accu

Página 93 - Figure. 5-28

Conceptually, there are two methods of defining the short bar’s impedance: One is to assume theimpedance to be zero. This has been a primordial metho

Página 94 - 5-8. Resonator measurement

SECTION 1Impedance measurement basics1-1. ImpedanceImpedance is an important parameter used to characterize electronic circuits, components, and thema

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4-6-7. Electrical length compensationIn the lower frequency region, using the open/short compensation function can minimize most oftest fixture residu

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4-6-8. Practical compensation techniqueThe calibration and compensation methods suitable for measurement are different for how the testcable or fixtur

Página 97 - 5-9. Cable measurements

Figure 4-17. Difference in residual parameter values due to DUT positioning4-7-2. A difference in contact conditionChange in contact condition of the

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4-7-3. A difference in open/short compensation conditionsImproper open/short measurements deteriorate accuracy of compensated measurement results. If

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Figure 4-20. Eddy current effect and magnetic flux directivity of device4-7-5. Variance in environmental temperatureTemperature influences on the elec

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SECTION 5Impedance measurement applications and enhancementsImpedance measurement instruments are used for a wide variety of applications. In this se

Página 101 - 5-11. Battery measurement

Table 5-1. Capacitor typesType Application Advantage DisadvantageFilm Blocking, buffering. Wide range of capacitance Medium costbypass, coupling. and

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When we measure capacitors, we have to consider these parasitics. Impedance measurementinstruments measure capacitance in either the series mode (Cs-

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Precautions for capacitor measurement depend on the capacitance value being measured.High-value capacitance measurement is a low impedance measurement

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5-2. Inductor measurementAn inductor consists of wire wound around a core and is characterized by the core material used.Air is the simplest core mate

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Reactance takes two forms - inductive (XL) and capacitive (Xc). By definition, XL=2πfL andXc=1/(2πfC), where f is the frequency of interest, L is ind

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±0.001, the maximum measurable Q value is 90.9. See Appendix E for Q accuracy calculation equa-tion.) Except for resonant method, the impedance measu

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Figure 5-11. Q measurement accuracyFigure 5-12. Q measurement errorFurthermore, the following phenomena may occur when a cored inductor is measured us

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Figure 5-13. Harmonic distortion caused by inductor5-8

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5-3. Transformer measurementA transformer is one end-product of an inductor. So, the measurement techniques are the same asfor inductor measurement.

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Inter-winding capacitance (C) between the primary and the secondary is measured by connecting oneside of each winding to the instrument as shown in Fi

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Turns ratio (N) Approximate the turns ratio (N) by connecting a resistor in the secondary as shown inFigure 5-19 (a). From the impedance value measur

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The 4263B’s transformer measurement function enables the measurement of the N, M, L1 and theDC resistance of the primary by changing measurement circu

Página 113 - APPENDIX A

5-4. Diode measurementThe junction capacitance of a switching diode determines its switching speed and is dependent onthe reverse DC voltage applied t

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5-5. MOS FET measurementEvaluating the capacitances between the source, drain, and gate of an MOS FET is important indesign of high frequency and swit

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5-6. Silicon wafer C-V measurementThe C-V (capacitance vs. DC bias voltage) characteristic of a MOS structure is an important mea-surement parameter f

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1-2. Measuring impedanceTo find the impedance, we need to measure at least two values because impedance is a complexquantity. Many modern impedance m

Página 117 - Type of error Impedance

Figure 5-26. C-V measurement setup5-16

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As a result of extremely high integration of logic LSIs using MOS FETs, the thickness of the MOSFETs’ gate oxide is becoming thinner (less than 2.0 nm

Página 119 - Open and short compensation

5-7. High-frequency impedance measurement using the probeAs shown in Table 5-3, an RF I-V instrument can be used for a wafer’s L, C, and R measurement

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Figure. 5-28. 5-19

Página 121 - APPENDIX C

5-8. Resonator measurementThe resonator is the key component in an oscillator circuit. Crystal and ceramic resonators arecommonly used in the kHz and

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2. It is important to properly set the oscillator output level; resonators are test signal dependent.The minimum impedance value and the series resona

Página 123 - APPENDIX D

Figure 5-31. Resonator equivalent circuit mode5-22(a) (b)

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5-9. Cable measurementsThe characteristic impedance Z(Ω), capacitance per unit length C (pF/m) and the propagation con-stants α (dB/m) and β (rad/m) a

Página 125 - APPENDIX E

Figure 5-33. Measurement resultBalanced cable measurementA balun transformer is required for measuring balanced cable because the instrument’s UNKNOWN

Página 126 - Agilent Direct

5-10. Balanced device measurementWhen a balanced DUT (such as balanced cable or the balanced input impedance of a differentialamplifier) is measured,

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