2
Defect detection capability
All typical components found
in manufacturing of electronic
PCBAs, such as:
• ≥ 0.4 mm Ball Grid Array (BGA)
• Column Grid Array (CGA)
• Ball Grid Array (BGA) – non-collapsible
and collapsible
• Chip Scale Package (CSP)
• ≥ 0201 Chip: capacitor, resistor
• Polarized capacitors
• SMT connector and sockets
• Direct FET
• Fine pitch and standard gullwing
• JLead
• Leadless Chip Carrier (LCC)
• Metal Electrical Face (Melf)
• Plated Through-hole (PTH)
• Quad-Flatpack No Lead (QFN)
• Small Outline Transistor (SOT)
• Heat sinks
Defects detected
1
• Shorts
• Opens
• Missing component
• Non-wetting
• Billboards
• Tombstones
• Lifted leads
• Solderball
• Void (BGA, Paste)
• Insuffi cient solder
• Reversed tantalum capacitor
• Excess solder
1
Not all defects are applicable to all
types of component solder joints.
Test development environment
Medalist x6000 Microsoft® Windows®-based software solution used to defi ne
User Interface system and panel setups, perform verifi cation and editing of CAD,
setup tests and thresholds, and execute test programs.
Off-line test Optional off-line test development software enabling
development software application development on an off-line PC
CAMCAD Professional Optional software available to translate CAD data to Agilent’s format.
Contains integrated input fi lters for industry leading CAD systems.
Typical test • Less than 30 minutes to translate and verify CAD data
development time (using CAMCAD Professional)
• 4 hours to 1.5 days to develop application
Multiple levels of • Operator
login privilege • Developer
• Service
• System administrator
Line integration
Confi gurable board fl ow • Right or left fl ow-through
• Right or left pass-back
• Automatic panel width adjustment for fast line changeover
Transport heights Transport height levels between 823 mm – 980 mm (32.4 in – 38.6 in)
Line communication SMEMA
standard
Bar code readers
Compatible with most industry standard manual
or automatic bar code readers
System
System controller Integrated controller with Dual Core Intel® Xeon® processors
Operating system Microsoft® Windows® XP Professional
Data communication USB, RS-232, 10/100/1000 Ethernet
interfaces
Data storage devices
CD/DVD RW
System footprint 1.52 m x 1.93 m (60 in x 76 in)
Integrated monitor Confi gurable for left or right of system. Adjustable for
and keyboard tray either sitting or standing positions
Total system weight
3220 kg (7100 lb)
Average system fl oor 371 kg/sqm (76 lb/sq ft)
loading weight/
service area
Concentrated loads
805 kg (1775 lb) on 152 mm (6 in) diameter pad,
4 pads on 131 cm (52 in) x 110 cm (43 in) centers
Test reporting and repair
Test result reports Medalist Quality Tool provides powerful pre-confi gurable views,
context-sensitive drill-downs, PC-based charting, and straightforward
export to Microsoft
®
Excel
®
.
Repair tools Medalist Repair Tool provides an intuitive, graphical interface
enabling operators to quickly locate and validate a given defect call.
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